What is the sputter yield?
Sputter yield (S) is an important parameter defined as the mean number of atoms removed from the target surface per incident ion.
How do you calculate sputtering yield?
It is found that the elemental and compound data expressed as the yields, Y, of atoms sputtered per primary ion may all be described by a simple universal equation: Y/n = (E/An)q/[1 + (E/An)q−1] where the parameters A and q are established by fitting.
What is sputtering yield What are the main factors that control sputtering yield?
The sputter yield depends on several things: the angle at which ions collide with the surface of the material, how much energy they strike it with, their masses, the masses of the target atoms, and the target’s surface binding energy.
What will be the sputter yield if the incident angle is 90 degree?
The sputtering yield of N atom at perpendicular incidence (90 degrees) is finite value of 0.2, but that of Ga atom is zero.
Why do we use sputtering?
Sputter coating prevents charging of the specimen, which would otherwise occur because of the accumulation of static electric fields. It also increases the amount of secondary electrons that can be detected from the surface of the specimen in the SEM and therefore increases the signal to noise ratio.
What is purpose of sputtering?
Sputtering is a Physical Vapor Deposition vacuum process used to deposit very thin films onto a substrate for a wide variety of commercial and scientific purposes. Sputtering occurs when an ionized gas molecule is used to displace atoms of a specific material.
What is meant by sputtering?
1 : to spit or squirt from the mouth with explosive sounds. 2 : to utter hastily or explosively in confusion or excitement “that’s ridiculous!” she sputtered. 3 : to dislodge (atoms) from the surface of a material by collision with high energy particles also : to deposit (a metallic film) by such a process.
How is sputtering done?
Sputtering is a plasma based deposition process in which energetic ions are accelerated towards a target. The ions strike the target and atoms are ejected (or sputtered) from the surface. These atoms travel towards the substrate and incorporate into the growing film.
Is sputtering done in vacuum?
Coating methods include Physical Vapor Deposition (PVD) and one technique is called Sputtering. The sputtering method of thin film deposition involves introducing a controlled gas, usually chemically inert argon, into a vacuum chamber, and electrically energizing a cathode to establish a self sustaining plasma.
Which is the drawback of sputtering PVD?
One of the cheaper power supplies with easy process control is the DC power supply and hence is the most used although the sputter yield is generally much lower [79]. This makes the DC power source the most used in magnetron or pulsed systems. Its major disadvantage is the low rate of ionization.
How is the yield of a sputtering ion determined?
Sputter yield is defined by how many atoms can be ejected from the target per sputtering ion (S y =target atom per sputtering ion). This yield depends on the respective masses ( M target , M ions ), the energy of the ion, E ion , and the bonding energy of the target material, E bind
What makes up the silicon dioxide sputtering target?
Silicon Dioxide Sputtering Target Description Silicon dioxide sputtering target from Stanford Advanced Materials contains Si and O. Silicon dioxide (SiO2), also known as Silica, is a natural compound made from two of the most abundant materials on the planet: silicon (Si) and oxygen (O2).
Which is the threshold energy for the sputter yield?
Eth is the threshold energy for sputtering, defined by Bohdansky’s expression: where Usb is the surface binding energy of the target atoms and is effectively the heat of sublimation per particle [1, chapter VII].
How much energy is needed for knock-on sputtering?
Knock-on sputtering: ion energies in the range of ~10 eV to 1 keV are of prime interest for commercial and industrial applications of sputtering.
